
WS-562JD-20 Electronic Adhesive
Gray appearance; thixotropy 50,000–70,000 cP Pin-to-pin replacement for SE4450,1-4173
Applications
Motor & Industrial Control
Bonding and sealing of motor & industrial control frames, ECU sensor housings, ABS and battery pack enclosures, PCB and module sealing protection.

Key Features
- Thermal conductivity: 1.92 W/m·K
- Density: 2.72 g/cm³
- Hardness: 93 Shore A; flame retardant UL94 V-0
- Bond strength: 3.5 MPa; broad substrate compatibility
- One-component packaging; heat-accelerated curing
- Low viscosity, suitable for silicone grease application processes
Import Replacement Cross-Reference
| This grade | WS-562JD-20 Electronic Adhesive, 1.92 W/m·K |
| Replaces | SE4450,1-4173 — pin-to-pin equivalent |
| Why switch | Same performance window, shorter lead time, direct factory support, no import premium |
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