Silicone Materials for Semiconductor & Microelectronics Applications
Advanced Silicone Materials for Semiconductor Applications — High-performance silicone solutions for semiconductor packaging, MEMS protection, optical devices and microelectronic applications.
Semiconductor Application Overview
Newsil can provide silicone material solutions for semiconductor and microelectronics applications. Our company supplies silicone materials for semiconductor packaging, MEMS protection, electronic module encapsulation, sensor sealing and insulation, optical device protection, and micro-optical replication. As a specialized silicone supplier, we focus on application-oriented formulation support, reliable quality control, sample and evaluation support, technical communication for material selection, and international customer service.
Advanced silicone encapsulation for semiconductor modules and IC devices.
Reliable protection for MEMS devices, sensors and microelectronic components.
Transparent and high-strength silicone for module protection.
Low-stress, high-insulation silicone for industrial and automotive sensors.
High-transparency silicone for LED encapsulation and lens molding.
High-refractive-index silicone for micro-lens arrays and waveguide replication.
Silicone Solutions for Semiconductor Applications
Three specialized silicone materials for the three main microelectronic application directions.
Fluorosilicone Gel for MEMS Protection
MEMS & Sensor Protection
Used for MEMS devices, automotive sensors, industrial sensors, electronic modules and other high-reliability protection and encapsulation applications.
Product: F100-2
Transparent Potting Compound
Transparent Semiconductor Encapsulation
Used for semiconductor modules, IC modules, optoelectronic devices and electronic component transparent potting and protection applications.
Product: R2150A-2
High-Refractive Optical Encapsulant
Optical & Micro-Structured Applications
Used for high-refractive-index optical silicone, micro-nano optical structure replication, micro-lens arrays, optical waveguides, diffractive optical elements and other advanced optical applications.
Product: R2352D-2
Recommended Silicone Solutions
F100-2
High Reliability Silicone for MEMS & Sensors. Single-component heat-cure fluorosilicone gel with viscosity 2500±300 mPa·s and excellent chemical resistance.
Key Application: MEMS, automotive sensors, industrial pressure sensors
Comparable Product: Wacker 927F
R2150A-2
Transparent Silicone Encapsulation. Two-component addition-cure 10:1 mix ratio silicone with >98% transmittance at 450nm and Shore A 50±5 hardness.
Key Application: Semiconductor modules, optoelectronic components, electronic protection
Comparable Product: Industry Reference
R2352D-2 (TDS 1:1)
High-Refractive-Index Optical Silicone. Two-component 1:1 mix with refractive index >1.53, Shore D 52±3 hardness, >95% transmittance at 450nm.
Key Application: LED encapsulation, optical waveguide, micro-lens arrays
Comparable Product: Dow / Shin-Etsu Optical Materials
Application Areas
Semiconductor Packaging
IC modules, semiconductor encapsulation
MEMS Devices
Micro-electro-mechanical systems
Optical Components
LEDs, lenses, waveguides
Sensors
Industrial, automotive, pressure
Power Electronics
High-voltage insulation
Microelectronics
Module encapsulation
Why Choose Newsil
Dedicated to MEMS, semiconductor packaging, and microelectronic protection.
Customized formulation to meet specific application and process requirements.
ISO9001 certified manufacturing with full traceability.
Free sample provision for performance verification.
Engineering team available for application-specific discussion.
Responsive support for overseas customers in multiple time zones.
Talk to Our Technical Team
Welcome to contact us for TDS, samples, application advice and material selection support. We are ready to support your semiconductor and microelectronics projects with our specialized silicone materials.