R2352D-2
High-Refractive-Index Encapsulation Silicone
Product Description
This product is a two-part liquid silicone encapsulant with high strength and high hardness. It offers excellent adhesion to substrates such as PPA and metals, high light transmittance and good weather resistance. It reinforces the integrity of electronic devices and improves their waterproof and moisture-proof performance.
Typical Applications
Mold-top (molding) encapsulation
Technical Data
| Test Item | Result |
|---|---|
| Before Curing | |
| Appearance | A: transparent liquid B: transparent to slightly hazy liquid |
| Viscosity | A: 20000±2000 mPa·s B: 1150±200 mPa·s |
| Processability | |
| Mixing ratio (by weight) | 1 : 1 |
| Recommended cure process | Invert after dispensing + 150°C / 3 h |
| Working time (25°C) | ≥ 4 h |
| After Curing | |
| Hardness (Shore D) | 52 ± 3 |
| Light transmittance (450 nm) | > 95 % |
| Refractive index | > 1.53 (high refractive index) |
Instructions for Use
- Accurately weigh the required amounts of Parts A and B according to usage;
- Mix Parts A and B in a dry container, stir until uniform, then vacuum-degas to remove bubbles;
- Ensure the lead frames to be encapsulated are clean and free of substances that may cause cure inhibition. Bake the frames to remove moisture (150°C / 30 min) before the dispensing process;
- Recommended cure conditions: invert after dispensing + 150°C / 3 h.
Packaging
Supplied in plastic bottles; both Parts A and B are 1 kg/bottle.
Storage & Transportation
- Store original A and B parts separately, tightly sealed, in a cool, ventilated indoor place below 25°C; shelf life 6 months.
- This product is non-hazardous and can be transported as a general chemical.
- Both A and B components must be kept sealed; take care to prevent leakage during transportation.
Safety Information
Refer to the Material Safety Data Sheet (MSDS) of this product.
Precautions
- Both A and B components must be kept sealed; reseal any unused material after opening to avoid contact with moisture in the air;
- Keep LED chips and lead frames dry before encapsulation;
- The product is easily contaminated by compounds containing nitrogen, phosphorus, sulfur, ethynyl or polyvinyl groups, peroxides, and lead, tin or cadmium metal compounds, as well as condensation-type curing agents, which can affect vulcanization;
- A recommended operating environment temperature of 25±2°C is advised to avoid degassing and dispensing difficulties.
Notice
- The information contained herein is believed to be reliable; the data in this product description are factory standard values. Contents, product performance improvements and specifications are subject to change without notice.
- We only guarantee that the product meets its specifications. Since the conditions and methods of use of our products are beyond our control, this technical information should not be used as a substitute for the user’s own testing. If there is any doubt about the reliability of this product with a particular substrate or application, a comprehensive system reliability test is recommended first; you may also consult our technical staff for assistance.
- Some performance parameters of the product can be specially adjusted according to customer requirements; please contact our marketing department.
- Our silicone products are developed for general electronics industry applications. For other uses, testing must be carried out and compliance confirmed in accordance with relevant legal requirements before use.