WS-668-G20S-JH1 Two-Component Thermal Silicone Gel
Thermal conductivity: 2.0 ± 0.1 W
Thermal conductivity (W/m·K): 2.0 ± 0.1
Specific gravity: 2.0 ± 10%
Flammability rating: UL94 V-0
Volume resistivity (Ω·cm): ≥1.0 × 10¹⁴
Dielectric strength (kV/mm): ≥8
Mix ratio (weight): 1:1
Working time (25°C): 10–15 min
Initial curing time (25°C): 0.5 h
Thermal Interface Materials
It is widely used in thermal conductance, sealing and caulking protection of power battery packs and energy storage batteries of new energy vehicles.
Key Features
- Hardness: 55 ± 5 / 00
- Thixotropic
- Low oil bleeding
- Hardness aging stability: 15%
- Viscosity (A/B): 15–20 W
Technical Data
| Test item | WS-668-G20S-JH1 |
|---|---|
| Mix ratio | 1:1 |
| specific gravity | 2.0±10% |
| Working time | 10~15min/25℃ |
| Initial Curing Time | 0.5h/25℃ |
| After curing | Soft elastomer |
| (W/m.k)Thermal conductivity | 2.0±0.1 |
| Flammability rating | UL94V-0 |
| (Ω·cm)Volume resistivity | ≥1.0×10¹⁴ |
| (kv/mm)Dielectric strength | ≥8 |
| Test items | WS-668-G20S-JH1 |
| appearance | Grey paste |
| Odor | Odorless |
Import Replacement Cross-Reference
| This grade | WS-668-G20S-JH1 Two-Component Thermal Silicone Gel, 2.0 W/m·K |
| Replaces | DowTC-5515-lt — pin-to-pin equivalent |
| Why switch | Same performance window, shorter lead time, direct factory support, no import premium |