WS-9110R Potting Compound
Two-component silicone rubber, room-temperature or heat cure
Viscosity (mPa·s): Part A: 1300 ± 500 / Part B: 1500 ± 500
Mix ratio (weight): 1:1
Cure time (25°C): 4 h
Hardness (Shore A): 15 ± 5
Dielectric strength: ≥14 kV/mm
Volume resistivity (Ω·cm): 1.0 × 10¹³
Color: Part A: black / Part B: grey
Density (g/cm³): 1.05 ± 0.05
Replacement compatibility: Pin-to-pin replacement for Dow EE1100
Electronics Assembly & Protection
Used for potting, bonding and sealing of electronic modules and other complicated electronic products such as reversing radar with structures.
Key Features
- Cures to flexible elastomer — low stress on electronic components
- Good adhesion to metal and electronic components
- For potting/bonding/sealing of reversing radar modules and complex electronics
Technical Data
| Test item | WS-9110R |
|---|---|
| Color | Part A: black / Part B: grey |
| Viscosity (mPa·s) | A: 1300±500 / B: 1500±500 |
| Mix ratio (weight) | 1:1 |
| Density (g/cm³) | 1.05 ± 0.05 |
| Working time | 30 min/25°C |
| Cure time | 4 h/25°C |
| Hardness (Shore A) | 15 ± 5 |
| Temperature range | -50 ~ 160 °C |
| Dielectric strength | ≥14 kV/mm |
| Volume resistivity | 1.0×10¹³ Ω·cm |
Import Replacement Cross-Reference
| This grade | WS-9110R Potting Compound |
| Replaces | DowEE1100 — pin-to-pin equivalent |
| Why switch | Same performance window, shorter lead time, direct factory support, no import premium |
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