WS-9180G Potting Compound
Product features: Solvent-free, no by-products, minimal shrinkage
Thermal conductivity (W/m·K): 1.5 ± 10%
Mix ratio (weight): 1:1
Specific gravity: 2.6 ± 10%
Cure time: 24 h / 25°C; 30 min / 70°C
Hardness (Shore A): 45 ± 5
Dielectric constant: 4.0–5.5
Volume resistivity (Ω·cm): ≥1.0 × 10¹⁴
Dielectric strength: ≥14 kV/mm
Replacement compatibility: Pin-to-pin replacement for LORD SC320 / Dow TC6020
New Energy Potting
Newsil’s two-component condensation type silicone thermal potting adhesive is suitable for curing at room temperature. Due to high fluidity, it can easily penetrate into the gaps of electronic components. After curing, the potted electronic products are moisture-proof, waterproof, dust-proof, shock-proof, insulated, temperature-resistant, thermally conductive, with a longer service life. It is widely used for potting, bonding and thermal conduction of junction boxes of photovoltaic modules and other complex electronic products.
Key Features
- Thermal conductivity 1.5 W/m·K
- Good dielectric and flame-retardant properties
- Room-temperature cure, heat-accelerated
- Flows into component gaps; for OBC/DC-DC/ballast potting
Technical Data
| Test item | WS-9180G |
|---|---|
| Mix ratio | 1:1 |
| Specific gravity | 2.6 ± 10% |
| Cure time | 24 h/25°C, 30 min/70°C |
| Working time | 60-90 min/25°C |
| Hardness (Shore A) | 45 ± 5 |
| Dielectric constant | 4.0-5.5 |
| Volume resistivity | ≥1.0×10¹⁴ Ω·cm |
| Dielectric strength | ≥14 kV/mm |
| Thermal conductivity (W/m·K) | 1.5 ± 10% |
| Flammability | UL94 V-0 |
Import Replacement Cross-Reference
| This grade | WS-9180G Potting Compound, 1.5 W/m·K |
| Replaces | LORDSC320; DowTC6020 — pin-to-pin equivalent |
| Why switch | Same performance window, shorter lead time, direct factory support, no import premium |